Introducing Snapdragon S7 Pro Gen 1: The Power of Micro-Power Wi-Fi in Your Earbuds

Introducing the Latest Audio Innovation: Qualcomm's Snapdragon S7 and S7 Pro Gen 1 Sound Platforms

Qualcomm, known for its cutting-edge technologies, has unveiled its newest audio chips at the Snapdragon Summit in Hawaii. These chips are set to revolutionize the future of TWS earbuds, headphones, and speakers.

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The Qualcomm Snapdragon S7 and S7 Pro Gen 1 Sound platforms, equipped with Bluetooth 5.4, introduce groundbreaking features. The S7 Pro, in particular, incorporates micro-power Wi-Fi with speeds of up to 29 Mbps, offering extended range capabilities beyond traditional Bluetooth connections. This seamless transition between Bluetooth and Wi-Fi ensures a superior user experience.

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Imagine being able to roam around your home, office, or campus, enjoying uninterrupted music and calls. The S7 and S7 Pro provide six times the compute power and almost 100 times the AI power compared to their predecessors. This boost is made possible through the utilization of a dedicated Micro NPU AI engine. Brace yourself for an AI-driven audio experience in the future.

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Qualcomm emphasizes the integration of an unparalleled level of on-device AI in these platforms. This advanced AI technology enables hearing enhancement features to adapt and cater to user needs throughout the day. Automatic transitioning between different ANC modes based on the immediate environment is a prime example of this innovation. ANC is now in its 4th generation, promising an enhanced listening experience.

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The S7 and S7 Pro incorporate multiple DSP cores and a sensor hub, supported by a remarkable 300% increase in memory compared to the previous generation. The S7 Pro also offers 192kHz multi-channel lossless music streaming and enhanced multi-channel spatial audio for immersive gaming experiences.

Discover the future of audio technology with Qualcomm's Snapdragon S7 and S7 Pro Gen 1 Sound platforms. For more information, visit the official Qualcomm website.

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